Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames

Wafer-level Cu-Cu bonding technology

0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.04.016 ⇑ Corresponding author. E-mail address: [email protected] (K.-N. C Semiconductor industry currently utilizes copper wafer bonding as one of key technologies for 3D integration. This review paper describes both science and technology of copper wafer bonding with regard to present applications. The classifi...

Wafer Level Packaging Using High Force Bonding of Alge

Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding

To increase the yield of the wafer-level Cu-Cu thermo-compression bonding method, certain surface pre-treatment methods for Cu are studied which can be exposed to the atmosphere before bonding. To inhibit re-oxidation under atmospheric conditions, the reduced pure Cu surface is treated by H2/Ar plasma, NH3 plasma and thiol solution, respectively, and is covered by Cu hydride, Cu nitride and a s...

Novel Bonding technologies for wafer-level transparent packaging of MOEMS

Packaging costs of Micro-Electro-Mechanical System (MEMS) are still contributing with >50% to the total costs of most devices. Aligned wafer bonding techniques for Wafer-level packaging (WLP) demonstrates a huge potential to reduce these costs due to a smaller size of the total package, improved performance and shorter time to market. A special group of MEMS devices, Micro-OptoElectro-Mechanica...

Wafer Level Surface Activated Bonding Tool for MEMS Packaging

A wafer level surface activated bonding ~SAB! tool has been developed for microelectromechanical systems ~MEMS! packaging at low temperature. The tool accommodates 8 in. diam wafers. The principle features of the tool are the automatic parallel adjustment for 8 in. wafers to a margin of error within 61 mm and the X, Y, and u axis alignments with an accuracy of 60.5 mm. We have approached a new ...